cystech electronics corp. spec. no. : c457fp issued date : 2008.11.19 revised date :2013.12.31 page no. : 1/5 MBR20100AFP cystek product specification 20amp. schottky barrier rectifiers i f(av) 2 10a MBR20100AFP v rrm 100v tj 175 c v f features ? low v f and low i r type ? high junction temperature capability ? high current capability ? high surge capability ? good tradeoff between leakage current and forward voltage drop ? low power loss, high efficiency ? insulating package, insulating voltage=2000v dc, capacitance=45pf ? dual center tap schottky rectifier designed for high frequency miniat ure switched mode power supplies such as adaptors and on board dc/dc converters ? rohs compliant package mechanical data ? case: to-220fp molded plastic ? mounting position: any ? weight: 2.2 grams, 0.078 ounce approximately ? terminals: pure tin plated, lead-fre e, solderable per mil-std-750 method 2026 ? epoxy: ul 94v-0 rate flame retardant ? lead temperature for soldering purpose : 260 max. for 10 seconds equivalent circuit outline to-220fp 0.67v a k a MBR20100AFP
cystech electronics corp. spec. no. : c457fp issued date : 2008.11.19 revised date :2013.12.31 page no. : 2/5 MBR20100AFP cystek product specification maximum ratings and electrical ch aracteristics (per diode leg) ( rating at 25 c ambient temperature unless otherwise specified. single phase, half wave, 60hz, re sistive or inductive load. for capacitive load, derate current by 20%.) parameter symbol min. typ. max. units maximum recurrent peak reverse voltage v rrm 100 v maximum rms voltage v rms 70 v maximum dc blocking voltage v dc 100 v i f =10a, t c =25 0.85 i f =10a, t c =125 0.67 0.75 i f =20 a, t c =25 0.95 maximum instantaneous forward voltage at (note 1) i f =20a, t c =125 v f 0.85 v per diode 10 maximum average forward rectified current @ t c =145 per device i f(av) 20 a peak repetitive forward current (rated v r , square wave, 20khz) @t c =135 i frm 20 a peak forward surge curr ent @8.3ms single half sine wave superimposed on rated load (jedec method) i fsm 150 a peak repetitive reverse surge current (note 1 ), t j <175 i rrm 3.0 a v r =100 v, t c =25 5.0 a maximum instantaneous reverse current at v r =100 v, t c =125 i r 1.0 ma voltage rate of change, (rated v r ) dv/dt 10,000 v/ s typical junction capacitance @ f=1mhz and applied 4v reverse voltage c j 260 pf esd susceptibility (note 2) 8000 v storage temperature range t stg -55 +175 operating junction temperature range t j -65 +175 notes : 1. 2.0 s pulse width, f=1.0khz 2. human body model, 1.5k in series with 100pf thermal data parameter symbol value unit maximum thermal resistance, ju nction-to-case, per diode r th,j-c 3.5 c/w lead temperature for soldering purpos es : 1/8? from case for 5seconds t l 260 c ordering information device package shipping MBR20100AFP-0-ub-s to-220fp (rohs compliant package) 50 pcs / tube, 20 tubes/box, 10 boxes/carton environment friendly grade : s for rohs compliant products, g for rohs compliant and green compound products packing spec, ub : 50 pcs / tube, 20 tubes/box product rank, zero for no rank products product name
cystech electronics corp. spec. no. : c457fp issued date : 2008.11.19 revised date :2013.12.31 page no. : 3/5 MBR20100AFP cystek product specification characteristic curves forward current derating curve 0 5 10 15 20 25 0 25 50 75 100 125 150 175 case temperature---t c () average forward current---io(a) resistive or inductive load maximum non-repetitive forward surge current 0 50 100 150 200 1 10 100 number of cycles at 60hz peak forward surge current---i fsm (a) tj=150, 8.3ms single half sine wave, jedec method, per leg forward current vs forward voltage 1 10 100 1000 10000 100000 0 0.2 0.4 0.6 0.8 1 1.2 1.4 forward voltage---v f (v) instantaneous forward current---i f (ma) pulse width=300s, 1% duty cycle tj=25 tj=150 per leg junction capacitance vs reverse voltage 100 1000 0.1 1 10 reverse voltage---v r (v) junction capacitance---c j (pf) tj=25, f=1.0mhz per leg reverse leakage current vs reverse voltage 0.01 0.1 1 10 100 1000 0 20 40 60 80 100 120 140 percent of rated peak reverse voltage---(%) reverse leakage current---i r (a) tj=75 tj=25 tj=125 per leg
cystech electronics corp. spec. no. : c457fp issued date : 2008.11.19 revised date :2013.12.31 page no. : 4/5 MBR20100AFP cystek product specification recommended wave soldering condition product peak temperature soldering time pb-free devices 260 +0/-5 c 5 +1/-1 seconds recommended temperature profile for ir reflow profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 c/second max. 3 c/second max. preheat ? temperature min(t s min) ? temperature max(t s max) ? time(ts min to ts max ) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds time maintained above: ? temperature (t l ) ? time (t l ) 183 c 60-150 seconds 217 c 60-150 seconds peak temperature(t p ) 240 +0/-5 c 260 +0/-5 c time within 5 c of actual peak temperature(tp) 10-30 seconds 20-40 seconds ramp down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. note : all temperatures refer to topside of t he package, measured on the package body surface.
cystech electronics corp. spec. no. : c457fp issued date : 2008.11.19 revised date :2013.12.31 page no. : 5/5 MBR20100AFP cystek product specification to-220fp dimension *typical inches millimeters style: pin 1.anode 2.cathode 3.anode 3-lead to-220fp plastic package cystek package code: fp marking: date code device name inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.171 0.183 4.35 4.65 g 0.246 0.258 6.25 6.55 a1 0.051 ref 1.300 ref h 0.138 ref 3.50 ref a2 0.112 0.124 2.85 3.15 h1 0.055 ref 1.40 ref a3 0.102 0.110 2.60 2.80 h2 0.256 0.272 6.50 6.90 b 0.020 0.030 0.50 0.75 j 0.031 ref 0.80 ref b1 0.031 0.041 0.80 1.05 k 0.020 0.50 ref b2 0.047 ref 1.20 ref l 1.102 1.118 28.00 28.40 c 0.020 0.030 0.500 0.750 l1 0.043 0.051 1.10 1.30 d 0.396 0.404 10.06 10.26 l2 0.036 0.043 0.92 1.08 e 0.583 0.598 14.80 15.20 m 0.067 ref 1.70 ref e 0.100 * 2.54* n 0.012 ref 0.30 ref f 0.106 ref 2.70 ref notes: 1.controlling dimension: millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing specification or packing method, please c ontact your local cystek sales office. material: ? lead: pure tin plated. ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0. important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance .
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